The liquid thermal interface materials were originally designed for the automotive industry and the need for use highly automated production lines. These thermal interface materials have been used for over a decade in some of the most demanding electronic products on the market. Because of their success there, the demand for liquid thermal interface materials is rapidly rising in all of the electronic industry, as they assist in reducing the overall cost of manufacturing while increasing the thermal performance of assemblies.
The growth of liquid thermal interface materials solutions, are the advantages a dispensed material has in a highly automated assembly process. Many of these products have been created with efficient-dispensing as a key product characteristic. The cure-in-place versions of liquid thermal interface materials, when put under pressure in the dispensing system, will drop in viscosity and enable the material to be dispensed quickly. Since these liquid thermal interface materials can be dispensed to fill just about any dimension, they can often displace several different thermal interface materials used within the module. The liquid thermal interface materials can be used in both of these applications, and reduce the overall part count within the module.
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Thermal Interface Materials Market: Segmentation
On the basis of base material, the global thermal interface materials market can be categorized as:
Metal Based
Thermal Greases
Adhesives
Tapes & Films
Phase Change Materials
Others
On the basis of end-use industry, the global thermal interface materials market can be categorized as:
Telecom
Computers (IT/Enterprise)
Medical Device
Consumer Electronics
Automotive Electronics
Medical Devices
Other Industrial
Thermal Interface Materials Market: Regional Outlook
Global thermal interface materials market by region is segmented into North America, Latin America, Eastern Europe, Western Europe, South East Asia & Pacific (SEAPAC), China, Japan and MEA.
Thermal Interface Materials Market: Key Participants
Examples of some of the market participants operating in the global thermal interface materials market are as follows:
Parker Hannifin Corp
3M
Indium Corporation
Laird Technologies
Henkel AG & Co. KGaA
Honeywell International Inc
ZALMAN TECH CO LTD
Fujipoly
Kitagawa Industries
Honeywell International
Momentive Performance Materials Inc.
The research report presents a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, and statistically supported and industry-validated market data. It also contains projections using a suitable set of assumptions and methodologies. The research report provides analysis and information according to market segments such as geographies, application, and industry.
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